LCD용 COF NCP 패키징 공정설계 및 분석

Recently, LCD(Liquid Crystal Display) requires various technical challenge; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP(Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF. In this paper, we analyzed the process of the NCP in COF(Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we acquired the stable values of the design parameters for successful NCP process.