Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints

[1]  R. Darveaux.  Effect of simulation methodology on solder joint crack growth correlation , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[2]  A. R. Syed.  Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[3]  Klaus-Jurgen Wolter,et al.  Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[4]  Sung K. Kang,et al.  The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue , 2004 .

[5]  H. Reichl,et al.  Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[6]  P. Marjamaki,et al.  Deformation characteristics and microstructural evolution of SnAgCu solder joints , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

[7]  A. Syed.  Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[8]  N. Kelkar,et al.  Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package family , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..