Multifunctional interferometric platform for on-chip testing the micromechanical properties of MEMS/MOEMS

We develop a multifunctional interferometric platform for testing MEMS/MOEMS, measuring 3-D out-of-plane deflections and providing both material properties and motion behavior of microdevices. Specific metrology procedures are demonstrated to determine respectively the residual stress of silicon membranes compressively prestressed by SiOxNy plasma-enhanced chemical vapor deposition (PECVD), the vibration modes of PZT microactuators, as well as the expertise of scratch drive actuators.

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