论文信息 - Development of a flux-less soldering method by ultrasonic modulated laser - 字舞流文

Development of a flux-less soldering method by ultrasonic modulated laser

Young Pyo Kim | Ming Li | H. Bang | C. Wang

[1] Chin C. Lee,et al. Fluxless InSn bonding process at 140 °C , 2002 .

[2] Ricky W. Chuang,et al. High-temperature non-eutectic indium-tin joints fabricated by a fluxless process , 2002 .

[3] K. Tu,et al. Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .

[4] Jae-Yong Park,et al. Fluxless wetting propeities of one-side-coated under bump metallurgy and top surface metallurgy , 2001 .

[5] T. Herzog,et al. Plasma treatment for fluxless soldering , 2001 .

[6] Selcuk Cihangir and Simon Kwan,et al. Characterization of indium and solder bump bonding for pixel detectors , 2000 .

[7] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .

[8] K. Kondo,et al. Fluxless solder joining using alkane , 1998 .

[9] G. S. Bushanam. Laser‐generated thermoelastic shock wave in liquids , 1975 .

[10] Richard M. White,et al. Generation of Elastic Waves by Transient Surface Heating , 1963 .