Resonant-free PDN design®

The design of power distribution networks (PDNs) on printed circuit board (PCB) structures, or even on interconnect structures inside IC packages, typically results, with or without decoupling capacitors added, in a network full of impedance resonances. These resonances functionally hamper fast digital and RF designs from several MHz up to the GHz-range onwards and are the root cause for many EMC issues. These resonances are caused both by the physical size and geometry of the PCB and the decoupling as well as the loading components added to that PCB. Utilizing the characteristic impedance of the adjacent supply and ground layers correctly, results in a resonant free supply PDN with an impedance which can be made very low over an extremely broad frequency range. This, in combination with ‘Kelvin contact’ decoupled ICs, assures that the low impedance of the PDN can be maintained and multiple decoupling capacitors are no longer needed near to the IC pins. This offers great advantages for PCB space allocation and opens opportunities to more efficient routing. This extended concept has been verified by simulations. Additional measurements were taken to validate the concept.

[1]  O.P. Mandhana Effect of resonant free power delivery network design on VRM performance , 2005, Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005..

[2]  M. J. Coenen,et al.  Optimization techniques for minimizing IR-drop and supply bounce , 2005 .

[3]  Andrew B. Kahng,et al.  Signal and Power Integrity , 2008 .

[4]  Eby G. Friedman,et al.  Power Distribution Networks with On-Chip Decoupling Capacitors , 2007 .

[5]  Steve Weir,et al.  Pushing the Envelope Without Tears: An Advanced Power Delivery Solution , 2008 .

[6]  Eby G. Friedman,et al.  Multi-voltage CMOS Circuit Design , 2006 .

[7]  Minjia Xu,et al.  Power-bus decoupling with embedded capacitance in printed circuit board design , 2003 .

[8]  O.P. Mandhana Modeling, analysis and design of resonant free power distribution network for modern microprocessor systems , 2004, IEEE Transactions on Advanced Packaging.

[9]  Eric Bogatin,et al.  Signal and Power Integrity - Simplified , 2009 .

[10]  I. Novak,et al.  Overview of some options to create low-Q controlled-ESR bypass capacitors , 2004, Electrical Performance of Electronic Packaging - 2004.

[11]  Joungho Kim,et al.  Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..

[12]  Istvan Novak,et al.  Comparison of Power Distribution Network Design Methods , 2006 .

[13]  T. Sakusabe,et al.  Study on noise reduction effect using the decoupling capacitor with resistor on power distribution line , 2008, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.

[14]  Barruquer Moner IX. References , 1971 .

[15]  Joungho Kim,et al.  Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC , 2010 .

[16]  Jun Fan,et al.  Quantifying decoupling capacitor location , 2000, IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016).