A Dynamic Thermal Management Circuit for System-On-Chip Designs

A novel fully integrated dynamic thermal management circuit for system-on-chip design is proposed. Instead of worst-case thermal management used in conventional systems, this design yields continual monitoring of thermal activity and reacts to specified conditions. With the above system, we are able to incorporate on-chip power/speed modulation and integrated multi-stage fan controllers, which allows us to achieve nominal power dissipation and ensure operation within specification. Both architecture and circuitry are optimized for modern system-on-chip designs. This design yields intricate control and optimal mangement with little system overhead and minimum hardware requirements, as well as provides the flexibility to support different thermal mangement algorithms.

[1]  John Choma,et al.  A novel model for on-chip heat dissipation , 1998, IEEE. APCCAS 1998. 1998 IEEE Asia-Pacific Conference on Circuits and Systems. Microelectronics and Integrating Systems. Proceedings (Cat. No.98EX242).

[2]  Jeffrey T. Draper,et al.  Thermal Management in Embedded Systems Using MEMS , 1998, IPPS/SPDP Workshops.

[3]  J. W. Sofia.  Analysis of thermal transient data with synthesized dynamic models for semiconductor devices , 1994 .

[4]  Herming Chiueh,et al.  A novel fully integrated fan controller for advanced computer systems , 2000, 2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390).

[5]  John Choma,et al.  A programmable thermal management interface circuit for PowerPC systems , 2001 .

[6]  John Choma,et al.  Implementation of a Temperature Monitoring Interface Circuit for PowerPC systems , 2000, Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144).

[7]  M. Rencz,et al.  Thermal testing methods to increase system reliability , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[8]  Herming Chiueh,et al.  A high–speed CMOS on–chip temperature sensor , 1999 .

[9]  Sung-Mo Kang,et al.  Substrate thermal model reduction for efficient transient electrothermal simulation , 2000, 2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390).

[10]  Herming Chiueh,et al.  A THERMAL EVALUATION OF INTEGRATED CIRCUITS : ON CHIP OFFSET TEMPERATURE MEASUREMENT AND MODELING , 1998 .

[11]  J. Steele.  ACPI thermal sensing and control in the PC , 1998, Wescon/98. Conference Proceedings (Cat. No.98CH36265).

[12]  Márta Rencz,et al.  Electro-thermal and logi-thermal simulation of VLSI designs , 1997, IEEE Trans. Very Large Scale Integr. Syst..