Advances in creep-fatigue modelling of solder joints

[1]  J. Lau,et al.  Solder Joint Reliability: Theory And Applications , 2014 .

[2]  A. Pineau,et al.  Mechanical Behaviour of Materials , 2013 .

[3]  M. Bache.  A review of dwell sensitive fatigue in titanium alloys: the role of microstructure, texture and operating conditions , 2003 .

[4]  Robert Darveaux,et al.  Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction , 2002 .

[5]  H.L.J. Pang,et al.  Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy , 2000 .

[6]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[7]  Walter Schütz,et al.  A history of fatigue , 1996 .

[8]  Robert A. Ainsworth,et al.  Flaw Assessment Procedure for High-Temperature Reactor Components , 1992 .

[9]  W. Engelmaier.  Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling , 1983 .

[10]  A. Boresi,et al.  Design for creep , 1972 .

[11]  L. Coffin,et al.  A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal , 1954, Journal of Fluids Engineering.

[12]  S. Manson.  Behavior of materials under conditions of thermal stress , 1953 .

[13]  S. S. Manson,et al.  A linear time-temperature relation for extrapolation of creep and stress-rupture data , 1953 .

[14]  R. Ross,et al.  Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components , 1993 .

[15]  D. R. Frear,et al.  Solder mechanics : a state of the art assessment , 1991 .

[16]  F. Hauser,et al.  Deformation and Fracture Mechanics of Engineering Materials , 1976 .

[17]  S. Manson,et al.  Creep-fatigue analysis by strain-range partitioning. , 1971 .

[18]  E. W. C. Wilkins,et al.  Cumulative damage in fatigue , 1956 .

[19]  J. E. Dorn.  Some fundamental experiments on high temperature creep , 1955 .

[20]  O. Basquin.  The exponential law of endurance tests , 1910 .