Utilisation d'adhésifs respectueux de l'environnement pour la fabrication de panneaux dérivés du bois à faible émission de formaldéhyde : caractérisation des paramètres de pressage : évaluation des propriétés des panneaux

The standards concerning the formaldehyde emissions2 from wood based panels have become more restrictive; alternatives meeting the requirements of the standards are needed. Therefore, solutions for the industrial use of three types of adhesives were studied which are; tannin adhesives by silica-induced autocondensation, Urea-formaldehyde (UF) / polymeric phenyl isocyanate (pMDI) hybrid adhesives and formulations based on dimethoxyethanal (DME). The study related to the tannins showed that an industrial production of large particle particle boards pressed with steam injection is possible. The analyses made it possible to evaluate the tannin autocondensation reactions of the formulations and to optimize them for steam injection pressing. Most of the studied formulations satisfied the qualitative requirements of the standard for both internal bond strength and formaldehyde emission2. Besides, the potential use for exterior grade of these panels remains problematic. The experimentations on the UF/pMDI adhesives increased the knowledge in the field of the adhesives-panel properties interactions for medium density fiberboard (MDF). Important results were obtained by the study of the resin distribution by confocal laser scanning microscopy (CLSM). Best results concerning the improvement of the panel properties were obtained for adhesive mixtures with low molar ratio UF and emulsifiable pMDI, satisfying the requirements of the standard, grade F **. However, grade F **** could only be reached by using 100 % of MDI. During the study related to the formulations of DME derived resins, new adhesive formulations were developed. The most promising formulation was selected and validated on industrial scale. It has shown to be able to satisfy the qualitative requirements of the standards with low formaldehyde emission2.

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