Young's modulus determination of low-k porous films by wide-band DCC/LD LSAW

Low-k interconnection is one of the key concepts in the development of high-speed ultra-large-scale integrated (ULSI) circuits. To determine the Young's modulus of ultra thin, low hardness and fragile low-k porous films more accurately, a wideband differential confocal configured laser detected and laser-generated surface acous- tic wave (DCC/LD LSAW) detection system is developed. Based on the light deflection sensitivity detection prin- ciple, with a novel differential confocal configuration, this DCC/LD LSAW system extends the traditional laser generated surface acoustic wave (LSAW) detection system's working frequency band, making the detected SAW signals less affected by the hard substrate and providing more information about the thin porous low-k film under test. Thus it has the ability to obtain more accurate measurement results. Its detecting principle is explained and a sample of porous silica film on Si (100) is tested. A procedure of fitting an experimental SAW dispersion curve with theoretical dispersion curves was carried out in the high frequency band newly achieved by the DCC/LD LSAW system. A comparison of the measurement results of the DCC/LD LSAW with those from the traditional LSAW shows that this newly developed DCC/LD LSAW can dramatically improve the Young's modulus measuring accuracy of such porous low-k films.

[1]  K. Chao,et al.  Microstructure and Mechanical Properties of Surfactant Templated Nanoporous Silica Thin Films: Effect of Methylsilylation , 2003 .

[2]  B. Yoon,et al.  Low-pressure CMP for reliable porous low-k/Cu integration , 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

[3]  Y. S. Lin,et al.  Ordered mesoporous and macroporous inorganic films and membranes , 2004 .

[4]  M. Baklanov,et al.  Determination of Young's Modulus of Porous Low-k Films by Ellipsometric Porosimetry , 2002 .

[5]  T. Kikkawa,et al.  Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves , 2004 .

[6]  S. Schulz,et al.  Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves , 2001 .

[7]  C. Glorieux,et al.  Surface acoustic wave characterization of a thin, rough polymer film , 2009 .

[8]  A scalable low-k/Cu interconnect technology using self-assembled ultra-low-k porous silica films , 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

[9]  Shisheng Lin,et al.  Evaluation of ultra-low-k dielectric materials for advanced interconnects , 2001 .

[10]  Michael Panzner,et al.  Non-destructive evaluation of diamond and diamond-like carbon films by laser induced surface acoustic waves , 1997 .

[11]  T. Kikkawa,et al.  Influence of Humidity on Electrical Characteristics of Self-Assembled Porous Silica Low-k Films , 2005 .

[12]  J. Monchalin Optical Detection of Ultrasound , 1986, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[13]  Daniele Passeri,et al.  Local indentation modulus characterization via two contact resonance frequencies atomic force acoustic microscopy , 2007 .

[14]  T. Kikkawa,et al.  Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores , 2005 .

[15]  A. Paul,et al.  Young's modulus of (Ti,Si)N films by surface acoustic waves and indentation techniques , 2002 .

[16]  K. Kohmura,et al.  Novel self-assembled ultra-low-k porous silica films with high mechanical strength for 45 nm BEOL technology , 2003, IEEE International Electron Devices Meeting 2003.