TURBULENT FLOW AND HEAT TRANSFER OVER HEATED MODULES FOR A WIDE RANGE OF REYNOLDS NUMBERS AND MODULE SIZE

Computational prediction of turbulent fluid flow and heat transfer over heated modules of different sizes in a channel is presented. We assume that the channel is formed between two adjacent circuit boards with surface-mounted heat generating modules mounted on a single side of each board. The pressure drop and heat transfer coefficient over each module are calculated for wide range of Reynolds numbers. The standard k - e model has been used for Reynolds number of 7000 or higher while low Reynolds number model has been used for Reynolds range of 2000–6000. A computational study has been carried out in order to develop performance map for the flow and heat transfer characteristics over various sizes of heated modules (B/L = 0.375 ~ 0.625) and for a wide range of Reynolds number (ReH = 2000 ~ 10,000). The correlation of heat transfer coefficient and pressure drop with Reynolds number and dimension of modules has also been established from this study.

[1]  F. Harlow,et al.  Numerical Calculation of Time‐Dependent Viscous Incompressible Flow of Fluid with Free Surface , 1965 .

[2]  W. Jones,et al.  The prediction of laminarization with a two-equation model of turbulence , 1972 .

[3]  C. W. Hirt,et al.  Calculating three-dimensional flows around structures and over rough terrain☆ , 1972 .

[4]  Klaus Bremhorst,et al.  A Modified Form of the k-ε Model for Predicting Wall Turbulence , 1981 .

[5]  Ephraim M Sparrow,et al.  Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .

[6]  E. Sparrow,et al.  Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components , 1983 .

[7]  B. Launder,et al.  The numerical computation of turbulent flows , 1990 .

[8]  Mohammad Faghri,et al.  Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment , 1991 .

[9]  M. Durbin,et al.  Impingement Cooling of Electronics , 1992 .

[10]  Cristina H. Amon,et al.  Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows , 1993 .

[11]  Mohammad Faghri,et al.  A New Correlation for Pressure Drop in Arrays of Rectangular Blocks in Air-Cooled Electronic Units , 1994 .

[12]  A. Faghri,et al.  Fluid flow analysis in an axially rotating porous pipe with mass injection at the wall , 1995 .

[13]  Mohammad Faghri,et al.  A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components , 1995 .

[14]  B. Basu,et al.  A comparative study of forced and natural convection flow in a channel with discrete heated modules in turbulent regime , 1997 .

[15]  A comparative study of parametric variation in forced convection and mixed convection flow in a channel with discrete heated modules at high Reynolds number , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[16]  Pradip Majumdar,et al.  TURBULENT FLUID FLOWS AND HEAT TRANSFER CHARACTERISTICS IN FLOW CHANNELS WITH DISTRIBUTED CHIP MODULES , 1999 .