论文信息 - Thermal mismatch induced reliability issues for Cu filled through-silicon vias

Thermal mismatch induced reliability issues for Cu filled through-silicon vias

This paper reports on experiments assessing 3 potential impacts and reliability risks induced by the thermal mismatch between Cu and Si in Cu filled through-silicon via (TSV) integration in 3D technology. The results show that (1) the Cu stress is a higher contributor to stress in the Si than FEOL film edge effects induced by TSV etch; (2) Cu extrusion induced by BEOL processing does not lead to severe delamination/cracking in low-k BEOL layers above the TSV; (3) stress induced at the TSV bottom does not cause visible damage to the liner or backside passivation after wafer thinning.

[1] A. Jourdain,et al. 3D stacked IC demonstration using a through Silicon Via First approach , 2008, 2008 IEEE International Electron Devices Meeting.

[2] H. Reisinger,et al. Investigation into the effect of a “through silicon via”-process on the MOS transistor reliability of a standard 0.13µm CMOS technology , 2010, 2010 IEEE International Integrated Reliability Workshop Final Report.

[3] P. Soussan,et al. Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance , 2010, 2010 International Electron Devices Meeting.

[4] Bart Vandevelde,et al. Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration , 2010 .

[5] Bart Vandevelde,et al. Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu , 2011 .

[6] E. Beyne,et al. In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

[7] E. Beyne,et al. Impact of through silicon vias on front-end-of-line performance after thermal cycling and thermal storage , 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).