High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection system

High-density three-dimensional (3-D) packaging technology for a charge coupled device (CCD) micro-camera visual inspection system module has been developed by applying high-density interconnection stacked unit modules. The stacked unit modules have fine-pitch flip-chip interconnections within Cu-column-based solder bumps and high-aspect-ratio Cu sidewall footprints for vertical interconnections. Cu-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump so as to achieve fine-pitch flip-chip interconnection with high-reliability. High-aspect-ratio Cu sidewall footprints were realized by the Cu-filled stacked vias at the edge of the substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stacked unit substrates simultaneously. The fabricated high-density 3-D packaging module has operated satisfactorily as the CCD imaging data transmission circuit. The technology was confirmed to be effective for incorporating many large scale integrated (LSI) devices of different sizes at far higher packaging density than it is possible to attain using conventional technology. This paper describes the high-density 3-D packaging technology which enables all of the CCD imaging data transmission circuit devices to be packaged into the restricted space of the CCD micro-camera visual inspection system interior.

[1]  C. P. Wong,et al.  Numerical and experimental investigations of large IC flip chip attach , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[2]  Nobuaki Takahashi,et al.  Three-dimensional memory module , 1998 .

[3]  Hiroshi Yamada,et al.  Advanced copper column based solder bump for flip-chip interconnection , 1997 .

[4]  Douglas O. Powell,et al.  Flip-chip on FR-4 integrated circuit packaging , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

[5]  Daniel F. Baldwin,et al.  A modular, direct-chip-attach MEMS package : Architecture and processing. , 2000 .

[6]  T. Togasaki,et al.  High-density 3D packaging technology for CCD micro-camera system module , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

[7]  K. Harsh,et al.  Flip-chip assembly for Si-based RF MEMS , 1999, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291).

[8]  Masanobu Kimura,et al.  Advanced three-dimensional packaging technology for high-density CCD micro-camera system module , 2000 .

[9]  Said F. Al-Sarawi,et al.  A Review of 3-D Packaging Technology , 1998 .

[10]  Timothy Clark Reiley,et al.  Chip-To-Package Interconnections , 1997 .

[11]  John Alderman,et al.  3-D packaging methodologies for microsystems , 2000 .

[12]  John H. Lau,et al.  Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies , 2001 .

[13]  H. Yamada.  Advanced three-dimensional assembly technology for high-density CCD micro-camera system module , 1999 .

[14]  Darvin R. Edwards,et al.  Multichip assembly with flipped integrated circuits , 1989 .

[15]  K. Tsuruta,et al.  Experimental Wireless Micromachine for Inspection on Inner Surface of Tubes , 2001 .

[16]  V. Bright,et al.  An embedded overlay concept for microsystems packaging , 2000 .