Experimental Investigation of Border Trap Generation in InGaAs nMOSFETs With $\hbox{Al}_{2}\hbox{O}_{3}$ Gate Dielectric Under PBTI Stress

The reliability performance of In<i>x</i>Ga<sub>1-</sub><i>x</i>As n-type metal-oxide-semiconductor field-effect transistors with Al<sub>2</sub>O<sub>3</sub> gate dielectric under positive-bias temperature instability stress is investigated systematically. A model of stress-induced border traps was proposed to interpret all charge pumping and <i>I</i>-<i>V</i> experimental results excellently. The stress-induced border traps include recoverable donor traps and permanent acceptor traps with respective energy densities Δ<i>D</i><sub>SOX</sub><sup>Donor</sup>(<i>E</i>) and Δ<i>D</i><sub>SOX</sub><sup>Acceptor</sup>(<i>E</i>) . The shapes of Δ<i>D</i><sub>SOX</sub><sup>Donor</sup>(<i>E</i>) and Δ<i>D</i><sub>SOX</sub><sup>Acceptor</sup>(<i>E</i>) have been extracted from experimental data. Δ<i>D</i><sub>SOX</sub><sup>Acceptor</sup>(<i>E</i>) mainly distributes in the conduction band of InGaAs with a tail extending to the mid-gap, whereas Δ<i>D</i><sub>SOX</sub><sup>Donor</sup>(<i>E</i>) has a large distribution inside the energy gap and extends to the conduction band. The high density of Δ<i>D</i><sub>SOX</sub><sup>Donor</sup>(<i>E</i>) in the energy gap induces large degradation in the off-current, which is particularly serious when the In composition <i>x</i> is raised to 0.65.

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