Cyanate ester resin modified by phenolic resin containing diphenyl oxide segments with high molecular weight

To obtain modified cyanate ester (CE) with good comprehensive properties and low cost, a novel phenolic resin containing diphenyl oxide (MPF) with high molecular weight was synthesized from diphenyl ether, formaldehyde, methanol and phenol by a two-step process which differed from polyphenylene oxide (PPO) in structure. The curing reaction and properties of the modified 2,2-bis(4-cyanatophenyl) propane (bisphenol-A-based cyanate ester, BADCy) by MPF were investigated. It was found that the curing temperature of the modified CE was lower than that of the unmodified CE. When the ratio of MPF and BADCy was 3:7, the cured resin exhibited low dielectric constant (3.00), low dielectric loss (0.0062) and high impact strength (12.5 kJ/m2), and its Td5% was 371 °C, being superior to CE in the comprehensive properties. When the content of MPF was above 30 %, MPF/BADCy had poor comprehensive properties. In order to improve MPF/BADCy with high content of MPF, epoxy resin (E51) was added. When the ratio of MPF, BADCy and E51 was 50:50:67, the cured resin exhibited low dielectric constant (2.96), dielectric loss (0.0078) and high impact strength (11.84 kJ/m2), and its Td5% was 365 °C. Small content of MPF or the combination of E51 and MPF were good for BADCy to improve its comprehensive properties.

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