论文信息 - On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging - 字舞流文

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo | Ching-Hsing Kao | Tung-Sheng Chen | Yao-Shing Chen

[1] Richard C. Jaeger,et al. Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture , 1992 .

[2] Arkady S. Voloshin,et al. Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry , 1990 .

[3] O. N. Tufte,et al. Piezoresistive Properties of Silicon Diffused Layers , 1963 .

[4] Guan-chang Jin,et al. Application of nondestructive testing methods to electronic industry using computer-aided optical metrology , 1996 .

[5] J. Murphy,et al. The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking , 1983 .