论文信息 - Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique - 字舞流文

Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique

Asisa Kumar Panigrahy | C. Kumari | P. K. Poola | M. Prakash | A. Navaneetha | S. Deepthi | A. Gudivada | A. K. Reddy