论文信息 - Preface to the Special Issue on Beyond Moore: Three-Dimensional (3D) Heterogeneous Integration

Preface to the Special Issue on Beyond Moore: Three-Dimensional (3D) Heterogeneous Integration

1School of Microelectronics, Xidian University, Xi’an 710071, China 2Institute of Microelectronics, Tsinghua University, Beijing 100084, China 3Department of Micro/nanoelectronics, Peking University, Beijing 100871, China 4Frontier Institute of Chip and System, Fudan University, Shanghai 200438, China 5Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117546, Singapore 6Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

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