Electroplating hanging rack system of semiconductor packing products

The invention relates to an electroplating hanging rack system of semiconductor packing products, which comprises a power supply, a controller and a hanging rack, wherein the controller is provided with two digital input ends; and the hanging rack is provided with an ultrasonic transducer and a combined aural and visual alarm which are respectively connected with the two digital input ends of the controller. Compared with the prior art, the electroplating hanging rack system of the semiconductor packing products can inspect the order of the products on the hanging rack in real time, and send out an audible and visual indication, thus ensuring that operating personnel do not take the products by mistake so as to prevent mixing batches, and avoiding economic losses.