Development and Challenge of Bare Die Technology

With the development of IC manufacture, the traditional encapsulation technology has not to satisfy the integrate circuits anymore, which are high performance, high integration and high reliability. As a result, bare dies are widely used in the new encapsulation technology currently, such as HIC and MCM, because of their advantages. The advantages and disadvantages of bare die technology are presented in this article, so as to make people can make a most use of bare die technology.One side, the use of bare die can improve the intergration and speed of the system, it’s the inevitability of bare die technology. The other side, aim at the problem of bare die technology, to improve the quality and reliability of bare die, the artile introduced two methods, that is develop KGD and ameliorate technics measure.