Liquid cooling of electronic devices becomes necessary when the chip-level heat fluxes increase and traditional air cooling encounters ever-increasing difficulties. From all the liquid cooling processes, spray cooling appears more successful due to its high critical heat flux, relatively low liquid flow rates, highly controllable, and the non-existence of boiling incipient hysterisis. This paper describes the development of the EDIFICE project (Embedded Droplet Impingement For Integrated Cooling of Electronics), which seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 50–100 W/cm2, employing latent heat of vaporization of dielectric fluids. Micro-spray nozzles are fabricated on silicon using MEMS technology to produce 100 micron droplets with odd shaped nozzles and swirling nozzles. The effects of shape, size, type of fluid, and swirling are tested and discussed. Spray heat transfer on silicon surfaces is studied with various surface texturing on the backside of the chip to promote spreading and evaporation of cold fluids as well as at heated conditions. The effects of configuration and fluids are revealed. Numerical modeling is used to study preliminary designs at both the device and system level. The paper describes progress made in the development of the EDIFICE device.