Surface roughness of single-crystal silicon etched by TMAH solution
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[1] A. Heuberger,et al. Anisotropic Etching of Crystalline Silicon in Alkaline Solutions I . Orientation Dependence and Behavior of Passivation Layers , 1990 .
[2] U. Schnakenberg,et al. TMAHW etchants for silicon micromachining , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
[3] E. Palik,et al. Etching roughness for (100) silicon surfaces in aqueous KOH , 1991 .
[4] O. J. Glembocki,et al. Hydration Model for the Molarity Dependence of the Etch Rate of Si in Aqueous Alkali Hydroxides , 1991 .
[5] O. Tabata,et al. Anisotropic etching of silicon in TMAH solutions , 1992 .
[6] Johannes G.E. Gardeniers,et al. Surface Morphology of p‐Type (100) Silicon Etched in Aqueous Alkaline Solution , 1996 .
[7] David J. Schiffrin,et al. AFM study of surface finish improvement by ultrasound in the anisotropic etching of Si in KOH for micromachining applications , 1997 .
[8] C. Tellier,et al. Micromachining of (hhl) silicon structures: experiments and 3D simulation of etched shapes , 1997 .
[9] Kazuo Asaumi,et al. Anisotropic-etching process simulation system MICROCAD analyzing complete 3D etching profiles of single crystal silicon , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.
[10] A. Koide,et al. Simulation of three-dimensional etch profile of silicon during orientation dependent anisotropic etching , 1991, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.
[11] Birgit Hannemann,et al. Anistropic multi-step etch processes of silicon , 1997 .
[12] Yasuroh Iriye,et al. Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration , 1998 .
[13] M. Shikida,et al. Roughening of single-crystal silicon surface etched by KOH water solution , 1999 .
[15] Ralu Divan,et al. Roughning and smoothing dynamics during KOH silicon etching , 1999 .
[16] Yasuroh Iriye,et al. Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation , 1999 .
[17] M. Shikida,et al. Differences in anisotropic etching properties of KOH and TMAH solutions , 2000 .
[18] Kazuyuki Inoue,et al. Effects of small amount of impurities on etching of silicon in aqueous potassium hydroxide solutions , 2000 .