Thermoelectric Property Studies on Cu‐Doped n‐type CuxBi2Te2.7Se0.3 Nanocomposites

Combining high energy ball‐milling and hot‐pressing, significant enhancements of the thermoelectric figure‐of‐merit (ZT) have been reported for p‐type Bi0.4Sb1.6Te3 nanocomposites. However, applying the same technique to n‐type Bi2Te2.7Se0.3 showed no improvement on ZT values, due to the anisotropic nature of the thermoelectric properties of n‐type Bi2Te2.7Se0.3. Even though texturing was effective in improving peak ZT of Bi2Te2.7Se0.3 from 0.85 to 1.04, reproducibility from batch to batch remains unsatisfactory. Here, we show that good reproducibility can be achieved by introducing an optimal concentration of 0.01 copper (Cu) per Bi2Te2.7Se0.3 to make Cu0.01Bi2Te2.7Se0.3 samples. A peak ZT value of 0.99 was achieved in Cu0.01Bi2Te2.7Se0.3 samples without texturing. With texturing by re‐pressing, the peak ZT was increased to 1.06. Aging in air for over 5 months did not deteriorate but further improved the peak ZT to 1.10. The mechanism by which copper improves the reproducibility, enhances the carrier mobility, and reduces the lattice thermal conductivity is also discussed.

[1]  Weishu Liu,et al.  High-performance nanostructured thermoelectric materials , 2010 .

[2]  W. S. Liu,et al.  Experimental studies on anisotropic thermoelectric properties and structures of n-type Bi2Te2.7Se0.3. , 2010, Nano letters.

[3]  A. Mackie,et al.  Current Opinion in Colloid & Interface Science , 2010 .

[4]  G. J. Snyder,et al.  Interfaces in bulk thermoelectric materials: A review for Current Opinion in Colloid and Interface Science , 2009 .

[5]  Osamu Yamashita,et al.  Effect of the cooling rate on the thermoelectric properties of p-type (Bi0.25Sb0.75)2Te3 and n-type Bi2(Te0.94Se0.06)3 after melting in the bismuth–telluride system , 2009 .

[6]  Gang Chen,et al.  Bulk nanostructured thermoelectric materials: current research and future prospects , 2009 .

[7]  M. Dresselhaus,et al.  Structure study of bulk nanograined thermoelectric bismuth antimony telluride. , 2009, Nano letters.

[8]  Weishu Liu,et al.  Improvement of Thermoelectric Performance of CoSb3-xTex Skutterudite Compounds by Additional Substitution of IVB-Group Elements for Sb , 2008 .

[9]  L. Bell Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems , 2008, Science.

[10]  Gang Chen,et al.  Enhanced thermoelectric figure-of-merit in p-type nanostructured bismuth antimony tellurium alloys made from elemental chunks. , 2008, Nano letters.

[11]  Weishu Liu,et al.  Enhanced thermoelectric and mechanical properties in textured n-type Bi2Te3 prepared by spark plasma sintering , 2008 .

[12]  M. Dresselhaus,et al.  High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys , 2008, Science.

[13]  Gang Chen,et al.  Diffusion of nickel and tin in p-type (Bi,Sb)2Te3 and n-type Bi2(Te,Se)3 thermoelectric materials , 2008 .

[14]  Weiyou Yang,et al.  Thermoelectric properties of Cu-doped n-type (Bi2Te3)0.9-(Bi2-xCuxSe3)0.1(x = 0-0.2) alloys , 2007 .

[15]  Jingfeng Li,et al.  Enhanced thermoelectric properties in CoSb3-xTex alloys prepared by mechanical alloying and spark plasma sintering , 2007 .

[16]  T. Kajitani,et al.  Protections of the aging of n-type Bi–Te thermoelectric materials doped with Cu or Cu-halide , 2007 .

[17]  J. Nurnus,et al.  Structural and thermoelectric properties of epitaxially grown Bi2Te3 thin films and superlattices , 2006 .

[18]  Jun Jiang,et al.  Fabrication and thermoelectric performance of textured n-type Bi2(Te,Se)3 by spark plasma sintering , 2005 .

[19]  Jun Jiang,et al.  Thermoelectric properties of textured p-type (Bi,Sb)2Te3 fabricated by spark plasma sintering , 2005 .

[20]  J. Navrátil,et al.  Copper intercalation into Bi2Te3 single crystals , 2004 .

[21]  Sung-Ho Lee,et al.  Thermoelectric properties of newly fabricated n-type 95%Bi2Te2–5%Bi2Se3 alloys by gas atomizing and extrusion process , 2003 .

[22]  D. Maier Strain-field domain structure in Bi2Te3 thermoelectric materials , 2002 .

[23]  T. Oh,et al.  Thermoelectric properties of (Bi0.25Sb0.75)2Te3 alloys fabricated by hot-pressing method , 2001 .

[24]  P. Konstantinov,et al.  Physical properties of Bi2Te2.85Se0.15 single crystals doped with Cu, Cd, In, Ge, S, or Se , 2000 .

[25]  N. V. Kolomoets,et al.  Thermoelectric properties of the hot-pressed (Bi,Sb) 2 (Te,Se) 3 alloys , 2000 .

[26]  J. Seo,et al.  Thermoelectric properties of n-type SbI3-doped Bi2Te2.85Se0.15 compound fabricated by hot pressing and hot extrusion , 2000 .

[27]  H. Goldsmid,et al.  Electro-deposited copper in bismuth telluride , 1970 .

[28]  W. Tiller,et al.  Effects of Heavy Deformation and Annealing on the Electrical Properties of Bi2Te3 , 1962 .

[29]  H. J. Goldsmid,et al.  Recent Studies of Bismuth Telluride and Its Alloys , 1961 .