The ABB Flat Low Inductance Package (FLIP ® ) technology enables the production of High Power IGBT Modules from 1800 A, 1800 V to 1200 A, 3300 V with an internal inductance as low as 3 nH . This represents an improvement of a factor of 2 compared to conventional modules at this power level. Because of a novel terminal arrangement inside the module, the internal terminal and bond wire arrangement contributes only 0.2 nH to the total module inductance. All other parasitic inductance originates from the screw type terminal contacts to the outer power circuit. The new terminal arrangement enables an improved high power inverter construction which results in a total parasitic inductance of only 40 nH for an inverter in the MW range. This paper describes the internal module and the inverter construction, the test method to measure the module inductance, and the actual test results for different module configurations. Switching and short circuit test wave forms underline the relevance of the achievements for the application.
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