Impact of ground line position on CMOS interconnect behavior

We investigate the impact of ground line position as well as the effects of conductive substrates with different conductivities of 10 S/m (low), 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnects. Characteristic line parameters obtained from field calculations are validated with two-port network analyzer measurements of specially designed test structures in a frequency range up to 50 GHz.

[1]  M.F. Ktata,et al.  When are substrate effects important for on-chip interconnects? , 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

[2]  R. Marks A multiline method of network analyzer calibration , 1991 .

[3]  Dylan F. Williams,et al.  CHARACTERISTIC IMPEDANCE MEASUREMENT ON SILICON , 2000 .

[4]  H. Hasegawa,et al.  Properties of Microstrip Line on Si-SiO/sub 2/ System , 1971 .

[5]  M.F. Ktata,et al.  Crosstalk in product related bus systems using 110 nm CMOS technology , 2004, Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.