Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications

A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700 times 700mum on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed

[1]  D.D. Antono,et al.  1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme , 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

[2]  T. Sakurai,et al.  Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect , 2005, IEEE Journal of Solid-State Circuits.

[3]  Yoshida Hiroshi,et al.  A 950MHz Rectifier Circuit for Sensor Networks with 10m Distance , 2005 .

[4]  Y. Sugawara,et al.  A 13.56 MHz CMOS RF identification transponder integrated circuit with a dedicated CPU , 1999, 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278).

[5]  Wentai Liu,et al.  An optimal design methodology for inductive power link with class-E amplifier , 2005, IEEE Transactions on Circuits and Systems I: Regular Papers.