A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds

Abstract A new numerical procedure is developed for simulating the thermal oxidation diffusion of epoxy molding compounds (EMC). In this approach, the formal similarity of oxidation diffusion equation and the heat conduction equation is utilized to convert the oxidation diffusion issue to heat conduction issue, then a 2D finite element model of EMC is established, and the oxidation diffusion of EMC aged under 150 °C is implemented with the thermal conduction modules of software ANSYS. The concentration distribution of oxidation products and the distribution of elastic modulus are calculated in ANSYS in the oxidized layer after 100 h, 600 h and 1000 h of isothermal aging at 150 °C under atmospheric air. The comparison between the calculated results and the simulated and experimental data obtained from literature is conducted. Moreover, the influence of silica filler in EMC on the oxidation diffusion is analyzed preliminarily. The results indicate that the oxidation diffusion can be effectively simulated, and the fillers in EMC probably affect the oxidation diffusion process. Evidently, the proposed procedure is effective for simulating the issues of thermal oxidation of EMC, while further experimental validations are needed.

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