Through silicon via (TSV) equalizer

Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC) system. However, high-speed digital signals suffer from severe distortions induced by TSV interconnects. In this paper, we propose a TSV equalizer using an ohmic contact on a double-sided silicon interposer to reduce the inter-symbol interference (ISI) of the TSV interconnects in a 3D IC system.

[1]  R. R. Spencer,et al.  A low-power 170-MHz discrete-time analog FIR filter , 1998 .

[2]  Katsuyuki Sakuma,et al.  Three-dimensional silicon integration , 2008, IBM J. Res. Dev..

[3]  C.P. Yue,et al.  A Tunable Passive Filter for Low-Power High-Speed Equalizers , 2006, 2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers..

[4]  K. Takahashi,et al.  Through Silicon Via and 3-D Wafer/Chip Stacking Technology , 2006, 2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers..

[5]  Bryan Black,et al.  3D processing technology and its impact on iA32 microprocessors , 2004, IEEE International Conference on Computer Design: VLSI in Computers and Processors, 2004. ICCD 2004. Proceedings..

[6]  C. Patrick Yue,et al.  A low-power, 20-Gb/s continuous-time adaptive passive equalizer , 2005, 2005 IEEE International Symposium on Circuits and Systems.

[7]  Joungho Kim,et al.  High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging , 2006, 2006 1st Electronic Systemintegration Technology Conference.

[8]  R. Jaeger.  Introduction to microelectronic fabrication , 1987 .