Active isolation of electronic micro-components with piezoelectrically transduced silicon MEMS devices

Thin PZT films have a major interest for active control of mechanical structures. Precisely, it is an open field for the isolation of micro-components sensitive to dynamic effects. Indeed, the electronic components used, for example, in aircraft endure intense vibrations due to acceleration. These vibrations have some disturbing effects on the frequency stability and on the usable life of the electronic elements. The isolation of these elements becomes crucial to protect them from the vibrating environment. In order to manage this problem, it is advisable to isolate the electronic card either at the case level or at the card level or at the sensitive element level. The latter solution was chosen. Thus, we have direct access to the control electronics and the energy sources and the control energy is lower. An active suspension system is developed between the support and the sensitive element to be isolated. An original active suspension system is designed. Some modeling difficulties arise due to the existence of the inevitable bottom electrode common to the actuating layers and to the sensing layer.

[1]  Paul Muralt,et al.  Micromachined Ultrasonic Transducers and Acoustic Sensors Based on Piezoelectric Thin Films , 2004 .

[2]  Jean-François Deü,et al.  A two-dimensional closed-form solution for the free-vibrations analysis of piezoelectric sandwich plates , 2002 .

[3]  Seshu B. Desu,et al.  Fatigue and Hysteresis Modeling of Ferroelectric Materials , 1993 .

[4]  C. K. Lee Theory of laminated piezoelectric plates for the design of distributed sensors/actuators. Part I: Governing equations and reciprocal relationships , 1990 .

[5]  C. K. Lee,et al.  Piezoelectric modal sensor/actuator pairs for critical active damping vibration control , 1991 .

[6]  Robert J. Bernhard,et al.  Passive-adaptive vibration absorbers using shape memory alloys , 1999, Smart Structures.

[7]  Amâncio Fernandes,et al.  Analytical and numerical approaches to piezoelectric bimorph , 2003 .

[8]  Francis C. Moon,et al.  Laminated piezopolymer plates for torsion and bending sensors and actuators , 1989 .

[9]  P. Delobelle,et al.  A nonlinear electromechanical model for ferroelectric materials: application to soft-PZT thick films screen-printed on alumina substrate , 2003, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[10]  P. Laura,et al.  Comments on “Theory of laminated piezoelectric plates for the design of distributed sensors/actuators. Part I: Governing equations and reciprocal relationships” [J. Acoust. Soc. Am. 87, 1144–1158 (1990)] , 1991 .

[11]  Horn-Sen Tzou,et al.  A Study of Segmentation of Distributed Piezoelectric Sensors and Actuators, Part II: Parametric Study and Active Vibration Controls , 1994 .

[12]  J. Baborowski Microfabrication of Piezoelectric MEMS , 2004 .

[13]  André Preumont,et al.  FORCE FEEDBACK VERSUS ACCELERATION FEEDBACK IN ACTIVE VIBRATION ISOLATION , 2002 .

[14]  Aditi Chattopadhyay,et al.  Aeroelastic tailoring using piezoelectric actuation and hybrid optimization , 1999 .

[15]  Thomas M. Michelitsch,et al.  A simple model for the nonlinear material behavior of ferroelectrics , 1998 .

[16]  Dean Karnopp,et al.  Comparative Study of Optimization Techniques for Shock and Vibration Isolation , 1969 .

[17]  James K. Knowles,et al.  On a shock-induced martensitic phase transition , 2000 .

[18]  Marek Krawczuk,et al.  Dynamics and buckling of a multilayer composite plate with embedded SMA wires , 2000 .

[19]  N. Ganesan,et al.  Semianalytical finite element analysis of active constrained layer damping in cylindrical shells of revolution , 2001 .

[20]  Harvey Thomas Banks,et al.  Smart material structures: Modeling, estimation, and control , 1996 .

[21]  Wei Chen,et al.  A micro-electro-mechanical model for polarization switching of ferroelectric materials , 1998 .

[22]  José Herskovits,et al.  Active control of axisymmetric shells with piezoelectric layers: a mixed laminated theory with a high order displacement field , 2002 .

[23]  J. Argyris,et al.  TRIC: a simple but sophisticated 3-node triangular element based on 6 rigid-body and 12 straining modes for fast computational simulations of arbitrary isotropic and laminated composite shells , 1997 .

[24]  Usik Lee,et al.  Spectral element modeling for the beams treated with active constrained layer damping , 2001 .

[25]  Manuel Collet,et al.  Definition of mechanical design parameters to optimize efficiency of integral force feedback , 2005 .

[26]  Nicolas Ledermann,et al.  {1 0 0}-Textured, piezoelectric Pb(Zrx, Ti1−x)O3 thin films for MEMS: integration, deposition and properties , 2003 .