论文信息 - Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods - 字舞流文

Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods

Cell K. Y. Wong | Xuejun Fan | Hongyu Tang | F. Sun | Yang Liu | C. Yuan | Guoqi Zhang | Tuo Zheng | Chao Huang | Chenglong Zheng