论文信息 - A Novel Low Cost Package for Radio Frequency Applications

A Novel Low Cost Package for Radio Frequency Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

Shiban K. Koul | Sandeep Chaturvedi

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