Two-stage polymer embossing of co-planar microfluidic features for microfluidic devices

Abstract A two-stage embossing technique for fabricating microchannels for microfluidic devices is presented. A micromachined aluminum mold is used to emboss a polyetherimide (PEI) substrate with a relatively high glass transition temperature (Tg). The embossed PEI is then used as a mold for embossing an amorphous polyethylene terephthalate (APET) substrate with a lower Tg. The resulting APET substrate has the same features as those of the aluminum mold. Successful transfer of features from the aluminum mold to the APET substrate was verified by profilometry, and an application of this method in production of a microfluidic device is presented.

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