Physical model of dynamic Joule heating effect for reset process in conductive-bridge random access memory

Dynamic Joule heating effect of reset process in conductive-bridge random access memory (CBRAM) was investigated theoretically. By introducing the geometry effect of conductive filament (CF), the temperature and electric field distributions in the transient state in both one-dimen-sional and three-dimensional cases were discussed in detail. We found that the CF’s geometry plays an important role in the transient Joule heating process, and the transient thermal effect turns increasingly significant with increasing applied voltage in reset procedure. The proposed position where CF ruptures is between the location of temperature peak and narrow end of the CF rather than the point of temperature peak in the cone-shaped CF system. It is more interesting that the rupture of CF possibly occurs in transient process, before steady-state is established.

[1]  Qi Liu,et al.  Real‐Time Observation on Dynamic Growth/Dissolution of Conductive Filaments in Oxide‐Electrolyte‐Based ReRAM , 2012, Advanced materials.

[2]  C. Hwang,et al.  The conical shape filament growth model in unipolar resistance switching of TiO2 thin film , 2009 .

[3]  M. Rozenberg,et al.  Nonvolatile memory with multilevel switching: a basic model. , 2004, Physical review letters.

[4]  G. I. Meijer,et al.  Who Wins the Nonvolatile Memory Race? , 2008, Science.

[5]  Rainer Waser,et al.  Complementary resistive switches for passive nanocrossbar memories. , 2010, Nature materials.

[6]  N. Wu,et al.  Evidence for an oxygen diffusion model for the electric pulse induced resistance change effect in transition-metal oxides. , 2006, Physical Review Letters.

[7]  D. Neher,et al.  Charge mobility determination by current extraction under linear increasing voltages: Case of nonequilibrium charges and field-dependent mobilities , 2009, 0907.1513.

[8]  Run-Wei Li,et al.  Improvement of resistive switching in Cu/ZnO/Pt sandwiches by weakening the randomicity of the formation/rupture of Cu filaments , 2011, Nanotechnology.

[9]  Myoung-Jae Lee,et al.  Modeling for bipolar resistive memory switching in transition-metal oxides , 2010 .

[10]  P. Blaise,et al.  Prediction of semimetallic tetragonal Hf2O3 and Zr2O3 from first principles. , 2012, Physical review letters.

[11]  Frederick T. Chen,et al.  Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM , 2008, 2008 IEEE International Electron Devices Meeting.

[12]  K. Kinoshita,et al.  Consideration of switching mechanism of binary metal oxide resistive junctions using a thermal reaction model , 2007 .

[13]  Jae Hyuck Jang,et al.  Effects of heat dissipation on unipolar resistance switching in Pt∕NiO∕Pt capacitors , 2008, 0802.3739.

[14]  Shimeng Yu,et al.  Compact Modeling of Conducting-Bridge Random-Access Memory (CBRAM) , 2011, IEEE Transactions on Electron Devices.

[15]  D. Ielmini,et al.  Self-Accelerated Thermal Dissolution Model for Reset Programming in Unipolar Resistive-Switching Memory (RRAM) Devices , 2009, IEEE Transactions on Electron Devices.

[16]  R. Waser,et al.  Nanoionics-based resistive switching memories. , 2007, Nature materials.

[17]  K. Terabe,et al.  Diffusivity of Cu Ions in Solid Electrolyte and Its Effect on the Performance of Nanometer-Scale Switch , 2008, IEEE Transactions on Electron Devices.

[18]  X. Guan,et al.  Dynamic Modeling and Atomistic Simulations of SET and RESET Operations in $\hbox{TiO}_{2}$-Based Unipolar Resistive Memory , 2011, IEEE Electron Device Letters.

[19]  R. Dittmann,et al.  Redox‐Based Resistive Switching Memories – Nanoionic Mechanisms, Prospects, and Challenges , 2009, Advanced materials.

[20]  D. Ielmini,et al.  Modeling the Universal Set/Reset Characteristics of Bipolar RRAM by Field- and Temperature-Driven Filament Growth , 2011, IEEE Transactions on Electron Devices.

[21]  D. Ielmini,et al.  Study of Multilevel Programming in Programmable Metallization Cell (PMC) Memory , 2009, IEEE Transactions on Electron Devices.

[22]  R. C. Weast CRC Handbook of Chemistry and Physics , 1973 .

[23]  Qi Liu,et al.  Improvement of Resistive Switching Properties in $ \hbox{ZrO}_{2}$-Based ReRAM With Implanted Ti Ions , 2009, IEEE Electron Device Letters.

[24]  B Kahng,et al.  Scaling theory for unipolar resistance switching. , 2010, Physical review letters.

[25]  J. S. Lee,et al.  Occurrence of both unipolar memory and threshold resistance switching in a NiO film. , 2008, Physical review letters.

[26]  S. Balatti,et al.  Resistive Switching by Voltage-Driven Ion Migration in Bipolar RRAM—Part II: Modeling , 2012, IEEE Transactions on Electron Devices.

[27]  L. Larcher,et al.  Metal oxide RRAM switching mechanism based on conductive filament microscopic properties , 2010, 2010 International Electron Devices Meeting.

[28]  H. Yamamura,et al.  Heat capacity and thermodynamic functions of zirconia and yttria-stabilized zirconia , 1999 .

[29]  Qi Liu,et al.  On the resistive switching mechanisms of Cu/ZrO2:Cu/Pt , 2008 .

[30]  Zheng Fang,et al.  Transport properties of HfO_ {2- x} based resistive-switching memories , 2012 .

[31]  D. Pulfrey,et al.  Electronic Conduction and Space Charge in Amorphous Insulating Films , 1970 .