Low cost multi-layer ceramic package for flip-chip MMIC up to W-band

We have developed a low cost multi-layer low temperature co-fired ceramic (LTCC) package based on a mass production design rule for an MMIC up to W-band. The package structure includes a cavity for the flip-chip MMIC and coplanar feed-throughs improved to suppress radiation. Good small-signal characteristics of a 76 GHz-band amplifier mounted on the package are demonstrated.

[1]  K. Maruhashi,et al.  RF performance of a 77 GHz monolithic CPW amplifier with flip-chip interconnections , 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).

[2]  H. Massler,et al.  Advantages of flip chip technology in millimeter-wave packaging , 1997, 1997 IEEE MTT-S International Microwave Symposium Digest.

[3]  Katsuyuki Yoshida,et al.  Development of millimeter-wave package for consumer market , 1999 .

[4]  P. Heide,et al.  Novel 77 GHz flip-chip sensor modules for automotive radar applications , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

[5]  L. Desclos,et al.  Low-cost 60 GHz-band antenna-integrated transmitter/receiver modules utilizing multi-layer low-temperature co-fired ceramic technology , 2000, 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056).

[6]  Tatsuya Hirose,et al.  76 GHz Flip-chip MMICs in Through-hole Packages , 1998, 1998 28th European Microwave Conference.