In-situ doping of silicon using the gas immersion laser doping (GILD) process
暂无分享,去创建一个
[1] R. B. Merrill,et al. Hot-electron-induced degradation of conventional, minimum overlap, LDD and DDD N-channel MOSFETs , 1988, IEEE Circuits and Devices Magazine.
[2] G. Jellison,et al. Chapter 6 Time-Resolved Measurements During Pulsed Laser Irradiation of Silicon , 1984 .
[3] G. Masetti,et al. Modeling of carrier mobility against carrier concentration in arsenic-, phosphorus-, and boron-doped silicon , 1983, IEEE Transactions on Electron Devices.
[4] P. Carey,et al. Fabrication of submicrometer MOSFET's using gas immersion laser doping (GILD) , 1986, IEEE Electron Device Letters.
[5] P. Carey,et al. A shallow junction submicrometer PMOS process without high temperature anneals , 1988, IEEE Electron Device Letters.
[6] W. Oldham,et al. Channeling effect of low energy boron implant in , 1983, IEEE Electron Device Letters.
[7] Ettore Landi,et al. Numerical simulation of the gas immersion laser doping (GILD) process in silicon , 1988, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..