Packaging of microstrip circuits using bed of springs to suppress cavity modes - A replacement for bed of nails
暂无分享,去创建一个
[1] P. Kildal,et al. Comparison of bandwidths of mushroom-type EBG surfaces and corrugated and strip-type soft surfaces when used as narrow ground planes , 2008 .
[2] Jorge R. Costa,et al. Electromagnetic Characterization of Textured Surfaces Formed by Metallic Pins , 2008, IEEE Transactions on Antennas and Propagation.
[3] Eva Rajo-Iglesias,et al. Comparison of bandwidths of mushroom-type electromagnetic bandgap surfaces and corrugated and strip-type soft surfaces when used as narrow ground planes , 2008 .
[4] E. Rajo-Iglesias,et al. Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates , 2009, IEEE Antennas and Wireless Propagation Letters.
[5] E. Rajo-Iglesias,et al. Comparison of bandgaps of mushroom-type EBG surface and corrugated and strip-type soft surfaces , 2007 .
[6] P.-S. Kildal,et al. Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails , 2010, IEEE Microwave and Wireless Components Letters.