Influence of PTH offset angle in wave soldering with thermal-coupling method

Purpose – The aim of this study is to investigate the effects of offset angle in wave soldering by using thermal fluid structure interaction modeling with experimental validation. Design/methodology/approach – The authors used a thermal coupling approach that adopted mesh-based parallel code coupling interface between finite volume-and finite element-based software (ABAQUS). A 3D single pin-through-hole (PTH) connector with five offset angles (0 to 20°) on a printed circuit board (PCB) was built and meshed by using computational fluid dynamics preprocessing software called GAMBIT. An implicit volume of fluid technique with a second-order upwind scheme was also applied to track the flow front of solder material (Sn63Pb37) when passing through the solder pot during wave soldering. The structural solver and ABAQUS analyzed the temperature distribution, displacement and von Mises stress of the PTH connector. The predicted results were validated by the experimental solder profile. Findings – The simulation rev...

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