Automatic Packaging of Miniaturized Circuits
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This paper reviews the effort to utilize the advanced capabilities of semiconductor device fabrication and component interconnection techniques in the manufacture of digital computers. By taking advantage of the characteristics of these new devices and interconnections, substantial savings can be realized in manufacturing cost. If other potential advantages of this packaging capability are to be gained, it is important that all aspects of machine design, production, and maintenance be considered as an integrated whole.
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