论文信息 - Failure mechanism models for material aging due to interdiffusion

Failure mechanism models for material aging due to interdiffusion

This tutorial illustrates design situations where material aging due to interdiffusion in some components can compromise system performance over time, thereby acting as a wearout failure mechanism. Microstructural diffusion mechanisms, continuum diffusion models, and interdiffusion analysis techniques are presented to design against such failures. An example illustrates the application of the mechanisms, models, and techniques in electronic packaging. >

A. Dasgupta | A. Dasgupta | Junhui Li | Junhui Li

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