论文信息 - Thermal analysis of the ball grid array packages

Thermal analysis of the ball grid array packages

New quasi - 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.

Konstantin O. Petrosyants | Nikita I. Rjabov

[1] C.K. Wang,et al. Development of ball grid array packages with improved thermal performance , 2005, 2005 7th Electronic Packaging Technology Conference.

[2] Y.L.A El-Kady. Thermal Performance of Ball Grid Arrays and Thin Interface Materials , 2005 .

[3] Jidong Yang,et al. Reliability analysis of BGA packages - a tool for design engineers , 1999 .

[4] Igor A. Kharitonov,et al. Software system for semiconductor devices, monolith and hybrid IC's thermal analysis , 1995, Proceedings of EURO-DAC. European Design Automation Conference.

[5] Wataru Nakayama,et al. Electronic Packaging: Design, Materials, Process, and Reliability , 1998 .