An Overview of Metallization Technologies for High Voltage and Smart-Power Applications

Recent advances in high-voltage device technologies have resulted in stringent metallization requirements because of reduced feature size, and improved high-frequency switching and power-handling requirements. The emergence of smart-power applications demonstrate a critical need for processing compatibility of signal and power devices. This paper reviews the current status and future trends in metallization of silicon device technologies for high-voltage and smart-power applications.

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