Material Properties and Intermetallic Compounds of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)
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[1] D. W. Henderson,et al. The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures , 2006, 56th Electronic Components and Technology Conference 2006.
[2] M. Amagai. A study of nanoparticles in SnAg-based lead free solders for intermetallic compounds and drop test performance , 2006, 56th Electronic Components and Technology Conference 2006.
[3] M. Amagai,et al. High drop test reliability: lead-free solders , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[4] Masazumi Amagai,et al. High solder joint reliability with lead free solders , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[5] J. Pang,et al. Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..