TECHNICAL FEATURES Time Domain Analysis of a Printed Circuit Board Via

This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long microstrip transmission lines above a ground plane. An equivalent circuit consisting of capacitance and inductance is given. Time domain reflectometry measurements are taken on an experimental printed circuit board containing vias of various geometries. The responses of the test vias are measured as the radii of the pad, cylinder and ground plane clearance are swept. The empirical data are then compared to previously taken simulation data and the differences are discussed.