240 GHz antenna integrated on low-cost organic substrate packaging technology targeting high-data rate sub-THz telecommunication

The RF performance of advanced silicon technologies has enabled the development of highly integrated wireless System on Chip (SoC) from 60 GHz up to the sub-THz spectrum. Leveraging wide bandwidths available at sub-THz frequency, data rates above 10 Gb/s have already been demonstrated. However, in order to develop highly integrated and cost effective silicon-based sub-THz wireless SoC we also have to develop appropriate packaging and antenna technologies. In this paper, we investigate achievable performance of an antenna integrated on an organic substrate used by standard BGA packaging technology. A state-of-the-art antenna gain of ∼7 dBi is measured at 235 GHz and a wide bandwidth of ∼80 GHz seems achievable if appropriate manufacturing tolerance can be mastered.

[1]  Jean-François Lampin,et al.  THz Communications using Photonics and Electronic Devices: the Race to Data-Rate , 2015 .

[2]  Yang Shang-Hua,et al.  High-power continuous-wave terahertz generation through plasmonic photomixers , 2016 .

[3]  Ali M. Niknejad,et al.  A 240 GHz Fully Integrated Wideband QPSK Receiver in 65 nm CMOS , 2015, IEEE Journal of Solid-State Circuits.

[4]  S. Gambini,et al.  A 90 nm CMOS Low-Power 60 GHz Transceiver With Integrated Baseband Circuitry , 2009, IEEE Journal of Solid-State Circuits.

[5]  J. Lopez,et al.  HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution , 2012, Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation.

[6]  F. van Dijk,et al.  100 Gb/s Multicarrier THz Wireless Transmission System With High Frequency Stability Based on A Gain-Switched Laser Comb Source , 2015, IEEE Photonics Journal.

[7]  Philippe Chanclou,et al.  Things You Should Know About Fronthaul , 2015, Journal of Lightwave Technology.

[8]  Thomas Pfeiffer.  Next generation mobile fronthaul architectures , 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).

[9]  Cyril C. Renaud,et al.  Advances in terahertz communications accelerated by photonics , 2016, Nature Photonics.

[10]  Wen Wu,et al.  340 GHz On-Chip 3-D Antenna With 10 dBi Gain and 80% Radiation Efficiency , 2015, IEEE Transactions on Terahertz Science and Technology.

[11]  M. Spirito,et al.  Design, Fabrication, and Measurements of a 0.3 THz On-Chip Double Slot Antenna Enhanced by Artificial Dielectrics , 2015, IEEE Transactions on Terahertz Science and Technology.

[12]  Quan Xue,et al.  A 750–1000 GHz $H$ -Plane Dielectric Horn Based on Silicon Technology , 2016, IEEE Transactions on Antennas and Propagation.

[13]  Janusz Grzyb,et al.  A Fully Integrated 240-GHz Direct-Conversion Quadrature Transmitter and Receiver Chipset in SiGe Technology , 2016, IEEE Transactions on Microwave Theory and Techniques.