Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling
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R. Sun | R. Xiang | Liping Wang | S. Maruyama | Jibao Lu | Fakhr e. Alam | Cheng‐Te Lin | N. Jiang | K. Nishimura | Hang Zhang | D. Chen | Jinhong Yu | Hang Zhang | X. Tan | W. Dai | Jingyao Gao | Sudong Wu | Junjie Wang | Q. Yan | Le Lv | Huan Zhang