论文信息 - Thermal management of power electronics modules via acoustic micrography imaging

Thermal management of power electronics modules via acoustic micrography imaging

Acoustic micrography imaging is introduced to detect cracks, voids, porosity, coplanarity and delamination at the power module-heat spreader interface. Interfacial defect contents are correlated with measured thermal resistance to establish packaging guidelines for enhanced thermal management of power modules with an optimized bonding process of selected interface materials with minimized defects.

S. Haque | Guo-Quan Lu | J. Goings | Xingsheng Liu

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