A novel design of brush scrubbing in post-CMP cleaning
暂无分享,去创建一个
Weiming Lee | Zuqiang Qi | Wanjia Lu | Zuqiang Qi | Wanjia Lu | Weiming Lee | Weiming Lee
[1] Optimization of the physical cleaning condition for nanotechnology , 2011 .
[2] A. Philipossian,et al. Effect of Mechanical Properties of PVA Brush Rollers on Frictional Forces during Post-CMP Scrubbing , 2004 .
[3] S. G. Yiantsios,et al. Detachment of Spherical Microparticles Adhering on Flat Surfaces by Hydrodynamic Forces , 1995 .
[4] N. Moumen,et al. Removal of Submicrometre Alumina Particles from Silicon Oxide Substrates , 2001 .
[5] G. Burdick,et al. A Theoretical Analysis of Brush Scrubbing Following Chemical Mechanical Polishing , 2003 .
[6] Julio L. Rivera,et al. Lift-Off Behavior of Micro and Nanoparticles in Contact With a Flat Surface , 2013 .
[7] David Starosvetsky,et al. Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective , 2007 .
[8] Gupta,et al. Substrate Morphology and Particle Adhesion in Reacting Systems. , 2000, Journal of colloid and interface science.
[9] Gupta,et al. Analysis of Contact Interactions between a Rough Deformable Colloid and a Smooth Substrate. , 2000, Journal of colloid and interface science.
[10] R. Allen Bowling,et al. An Analysis of Particle Adhesion on Semiconductor Surfaces , 1985 .
[11] B. Derjaguin,et al. Theory of the stability of strongly charged lyophobic sols and of the adhesion of strongly charged particles in solutions of electrolytes , 1993 .
[12] Mukul M. Sharma,et al. The role of surface roughness and contact deformation on the hydrodynamic detachment of particles from surfaces , 1994 .
[13] A. Busnaina,et al. Submicron particle removal in post-oxide chemical–mechanical planarization (CMP) cleaning , 1999 .
[14] Werner Kern,et al. Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology, and Applications , 1994 .
[15] S. Levine. Problems of Stability in Hydrophobic Colloidal Solutions. II. On the Interaction of Two Colloidal Metallic Particles: Mathematical Theory , 1939 .
[16] S. Levine. Problems of Stability in Hydrophobic Colloidal Solutions. I. On the Interaction of Two Colloidal Metallic Particles. General Discussion and Applications , 1939 .
[17] Thomas H. Kuehn,et al. Particle removal from semiconductor wafers by megasonic cleaning , 1996 .
[18] Douglas W. Fuerstenau,et al. Mutual coagulation of colloidal dispersions , 1966 .
[19] W. Fernando,et al. Experimental and modeling studies of particle removal in post silicon chemical mechanical planarization cleaning process , 2011 .
[20] T. Ohmi,et al. Tribological Study of Brush Scrubbing in Post-Chemical Mechanical Planarization Cleaning in Non-porous Ultralow-k Dielectric/Cu Interconnects , 2011 .
[21] Shankar Ghosh,et al. Weak adhesion at the mesoscale: particles at an interface , 2013 .
[22] Goodarz Ahmadi,et al. On particle adhesion and removal mechanisms in turbulent flows , 1994 .
[23] Stephen P. Beaudoin,et al. Describing Hydrodynamic Particle Removal from Surfaces Using the Particle Reynolds Number , 2001 .
[24] Zuqiang Qi,et al. XPS study of CMP mechanisms of NiP coating for hard disk drive substrates , 2010 .
[25] Jianbin Luo,et al. A lubrication model between the soft porous brush and rigid flat substrate for post-CMP cleaning , 2011 .
[26] Milind Weling,et al. Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning , 1999 .
[27] Igor J. Malik,et al. Brush scrubbing emerges as future wafer-cleaning technology , 1997 .
[28] Hong Lin,et al. Particle adhesion and removal mechanisms in post-CMP cleaning processes , 2002, ASMC 2002.
[29] Investigation of particle adhesion force for green nanotechnology in post-CMP cleaning , 2012 .
[30] A. Philipossian,et al. Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning , 2012 .
[31] G. P. Dube,et al. Interaction between two hydrophobic colloidal particles, using the approximate Debye-Hückel theory. I. General properties , 1939 .
[32] A. Philipossian,et al. Tribological Attributes of Post-CMP Brush Scrubbing , 2004 .
[33] M. E. O'Neill,et al. A sphere in contact with a plane wall in a slow linear shear flow , 1968 .
[34] Mukul M. Sharma,et al. Factors controlling the hydrodynamic detachment of particles from surfaces , 1992 .
[35] J. A. V. BUTLER,et al. Theory of the Stability of Lyophobic Colloids , 1948, Nature.
[36] J. Israelachvili. Intermolecular and surface forces , 1985 .
[37] J. Visser,et al. PARTICLE ADHESION AND REMOVAL: A REVIEW , 1995 .
[38] Stephen P. Beaudoin,et al. A Theoretical Evaluation of Hydrodynamic and Brush Contact Effects on Particle Removal during Brush Scrubbing , 2003 .
[39] T. Kwon,et al. Characterization of TMAH based cleaning solution for post Cu-CMP application , 2013 .
[40] Bau-Tong Dai,et al. Post-Cu CMP cleaning for colloidal silica abrasive removal , 2004 .
[41] Kevin Cooper,et al. Simulation of the Adhesion of Particles to Surfaces. , 2001, Journal of colloid and interface science.
[42] G. Burdick,et al. Assessment of post-CMP cleaning mechanisms using statistically-designed experiments , 1998 .
[43] Goodarz Ahmadi,et al. Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning , 1999 .