High-current transmission line pulse characterization of aluminum and copper interconnects for advanced CMOS semiconductor technologies

High-current phenomena and electrostatic discharge (ESD) in both aluminum and copper interconnects using transmission line pulse (TLP) testing are reported. Critical current density-to-failure, J/sub crit/, is evaluated as a function of pulse width for both wire and via structures. Experimental results demonstrate that copper-based interconnects have superior ESD robustness compared to aluminum-based interconnects.

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