Package and Module Design

The insulated gate bipolar transistor (IGBT) chip must be protected by placing it inside a package. After a discussion of discrete device packaging, various approaches to building multichip IGBT modules are discussed including the flat-pack, press-pack cases. The thermal resistance of various approaches is provided. Smart power modules are described that combine the IGBT chips with their drive and protection circuits. The reliability and failure mechanisms of IGBT modules are discussed including problems created by thermal cycling. Wire bond liftoff and formation of solder voids are the major issues determining reliability.

[1]  Bantval J. Baliga,et al.  Large area MOS-gated power devices using fusible link technology , 1996 .

[2]  Dushan Boroyevich,et al.  Extraction of parasitics within wire-bond IGBT modules , 1998, APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition.

[3]  Y. Arita,et al.  Latest technology improvements of Mitsubishi IGBT modules , 1996 .

[4]  William W. Sheng,et al.  Power Electronic Modules: Design and Manufacture , 2004 .

[5]  M. Wittmann,et al.  200 kVA compact IGBT modules with double-sided cooling for HEV and EV , 2012, 2012 24th International Symposium on Power Semiconductor Devices and ICs.

[6]  H. Kirihata,et al.  Investigation of flat-pack IGBT reliability , 1998, Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242).

[7]  Kristian Bonderup Pedersen,et al.  Bond wire lift-off in IGBT modules due to thermomechanical induced stress , 2012, 2012 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).

[8]  Dan Chen,et al.  Compensator Design for Adaptive Voltage Positioning (AVP) for Multiphase VRMs , 2006 .

[9]  Dong-Seok Hyun,et al.  Improved Smart Power Modules for up to 7kW Motor Drive Applications , 2006 .

[10]  Wolfgang Fichtner,et al.  Lifetime prediction of IGBT modules for traction applications , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[11]  Stephane Azzopardi,et al.  Proposition of IGBT modules assembling technologies for aeronautical applications , 2008 .

[12]  Guo-Quan Lu,et al.  D2BGA Chip-Scale IGBT Package , 2001 .

[13]  Tatsuya Okuda,et al.  Inverter miniaturizing technologies for EV/HEV applications , 2001, IVEC2001. Proceedings of the IEEE International Vehicle Electronics Conference 2001. IVEC 2001 (Cat. No.01EX522).

[14]  Wuchen Wu,et al.  Reliability testing and analysis of IGBT power semiconductor modules , 1995 .

[15]  J. Steger,et al.  Novel high power semiconductor module for trench IGBTs , 2004, 2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs.

[16]  Bantval J. Baliga.  Smart power technology: an elephantine opportunity , 1990, International Technical Digest on Electron Devices.

[17]  Masahiro Koizumi,et al.  Reliability of thick Al wire bonds in IGBT modules for traction motor drives , 2000 .