DNA-based nanoparticle composite materials for EMI shielding

Composite materials, such as polymer-matrix containing conductive fillers, are very attractive for shielding electromagnetic interference (EMI) due to their high shielding efficiency and seamlessness, processability, flexibility, light-weight and low-cost. Here, we report a development of novel, DNA-based EMI-shielding materials (DESM), consisting of DNA and metal nanoparticles. It has been shown that a thin DESM layer (typically ~30 - 50 μm) could block EMI radiations up to 60 dB effectively over an RF frequency range from KHz to tens GHz, exhibiting excellent EMI shielding efficiency. A wide selection of metal nanoparticle fillers for DESM has been tested for their performance in EMI shielding efficiency. Among them, silver and carbon-based nanoparticles have demonstrated the best performance and were selected for further investigation. The silver-doped DESM films could be also non-conductive while their EMI shielding efficiency is still well-preserved. The nonconductive DESM could have a great potential in the microelectronics industries for EMI shielding on electronic devices and circuit boards.