Impact of probe configuration and calibration techniques on quality factor determination of on-wafer inductors for GHz applications

We demonstrate that the quality factors measured on on-wafer (spiral) inductor test-structures are largely influenced by the choice between ground-signal and ground-signal-ground probe configuration. In particular when the SOLT network analyzer calibration technique is used in combination with ground-signal probing, the quality factor value can be overestimated significantly.

[1]  J.A.M. Geelen,et al.  An improved de-embedding technique for on-wafer high-frequency characterization , 1991, Proceedings of the 1991 Bipolar Circuits and Technology Meeting.

[2]  L.F. Tiemeijer,et al.  Record Q spiral inductors in standard CMOS , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

[3]  R. Brock,et al.  QUBiC4: a silicon RF-BiCMOS technology for wireless communication ICs , 2001, Proceedings of the 2001 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.01CH37212).

[4]  Keith Jones,et al.  LRM and LRRM Calibrations with Automatic Determination of Load Inductance , 1990, 36th ARFTG Conference Digest.

[5]  Roger B. Marks,et al.  Comparison of On-Wafer Calibrations , 1991, 38th ARFTG Conference Digest.

[6]  D.B.M. Klaassen,et al.  A record high 150 GHz f/sub max/ realized at 0.18 /spl mu/m gate length in an industrial RF-CMOS technology , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).